the analysis and solutions of defective packaging cases.doc
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the analysis and solutions of defective packaging cases,abstract: analyze the root cause for the defective cases and further discussed the solution based on the process to ensure the reliability in smt production.key...
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此文檔由會員 樂吉吉 發(fā)布
Abstract: Analyze the root cause for the defective cases and further discussed the solution based on the process to ensure the reliability in SMT production.
Key words: Surface mounting technology; Ball grid array packaging; Defect; Solution
Key words: Surface mounting technology; Ball grid array packaging; Defect; Solution
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